NexGPU
NexGPU
High-performance xFusion server configurations and components integrated for next-generation AI workloads.
Reliable custom enterprise hardware and advanced system integrations engineered at our state-of-the-art facilities.
Founded in 2017, NexGPU Intelligent Computing Technology Co., Ltd. is a professional manufacturer specializing in GPU servers, AI computing infrastructure, high-performance computing (HPC) systems, and customized server solutions for global customers. Headquartered in Shenzhen, China, the company operates a modern manufacturing facility covering over 380 square meters, equipped with advanced assembly, testing, and quality control systems.
With more than 9 years of industry experience and 7 years of export experience, NexGPU has established itself as a trusted supplier for enterprises, cloud service providers, research institutions, AI startups, data centers, and system integrators worldwide. Our annual export revenue exceeds USD 18 million, serving customers across North America, Europe, Southeast Asia, the Middle East, and Oceania.
NexGPU maintains strict quality management standards throughout the production process. Every product undergoes comprehensive reliability testing, performance verification, burn-in testing, compatibility validation, and final inspection before shipment. Our dedicated quality control team consists of over 45 experienced inspectors, ensuring consistent product quality and reliability.
Our engineering division specializes in server architecture, thermal dynamics, system firmware optimizations, and dense GPU integration, driving over 80 hardware upgrades and new product designs annually.
Our strong components network enables quick sourcing of original modules, high-capacity enterprise SSDs, advanced PCIe RAID cards, and customizable server chassis to ensure highly competitive lead times.
Annual Export Value
Strategic Partners
R&D Engineers
QC Inspectors
An analysis of structural design, cooling dynamics, and configuration layouts within modern data centers.
Modern models like the FusionServer 2288H V6 and V7 employ dynamic energy-saving algorithms. Independent fan speed controls detect localized temperature fluctuations in Xeon scalables, decreasing system PUE values and maintaining hardware longevity.
With models such as the 1288H V7 and 5288 V7, the inclusion of PCIe Gen 5.0 channels doubles bandwidth throughput compared to previous generations, optimizing read/write speeds for enterprise NVMe arrays (e.g. Samsung PM9A3 series) and low-latency network cards.
xFusion multi-GPU servers accommodate full-height dual-slot GPU accelerators. They are built to handle dense transformer scaling, including DeepSeek and LLama inference operations, ensuring latency minimizations through high-bandwidth NUMA designs.
| Server Model | Processor Compatibility | Memory Capability | Storage / Drive Configurations | Expansion Capability |
|---|---|---|---|---|
| FusionServer 1288H V7 | Intel® Xeon® Scalable (Gen 4 / 5) | Up to 32x DDR5 DIMMs | 10x 2.5" SAS/SATA/NVMe SSDs | PCIe 5.0 support, dual-slot GPU options |
| FusionServer 2288H V6 | Intel® Xeon® Scalable (Gen 3) | Up to 32x DDR4 DIMMs | 8x 2.5" to 20x 3.5" configurations | PCIe 4.0 support, up to 4x GPU cards |
| FusionServer 5288 V7 | Intel® Xeon® Scalable (Gen 4) | Up to 32x DDR5 DIMMs | 40x 3.5" or 36x NVMe drives (Dense Storage) | Dedicated RAID controller options, high IOPS |
| FusionServer 2488H V5 | Intel® Xeon® Scalable (Gen 2) | Up to 48x DDR4 DIMMs | 25x 2.5" hot-swap SAS/SATA | 4-socket computing efficiency |
How our localized integration and logistics networks reduce overall equipment procurement costs.
Operating out of Shenzhen gives NexGPU access to the highest concentration of silicon fabricators, power supply developers, and structural chassis manufacturers globally. We leverage this strategic proximity to source premium materials—ranging from specialized Broadcom Tri-Mode controller cards like the 9560-8i to enterprise SAS storage units—in a fraction of the standard lead time.
Additionally, localized logistics corridors connect our assembly lines directly to Shenzhen and Hong Kong ports, offering rapid global customs clearance, flexible sea freight, and overnight air shipping configurations.
To meet global reliability parameters, our manufacturing process implements a strict multi-phase Quality Assurance cycle:
Mitigating deployment risks through certified safety compliance, network configurations, and regional assistance.
Our server assemblies comply with international safety standards, including CE, FCC, RoHS, and UL certificates. This guarantees seamless data center integration and regulatory clearance across North American, European, and Asia-Pacific regions.
We provide localized BMC, Redfish API, and system BIOS customizations tailored to specific cloud system integrations. Our options feature integrated security parameters, remote management utilities, and secure boot technologies.
Each shipment includes remote diagnostic support and engineering consulting. Our global SLA partnerships offer on-site part replacement warranties to minimize network downtime.
Key movements shaping high-performance computing design and deployment architectures.
With processors exceeding 350W TDP limits, standard air-cooling designs are shifting toward liquid-to-air cooling manifolds. Modern architectures like the FusionServer V7 lineup accommodate liquid-cooling loop integrations, enabling companies to meet green energy initiatives and lower compute operational expenditures.
High-density parallel processing requires low-latency ethernet structures. Modern xFusion models support PCIe Gen 5 InfiniBand and RoCE v2 integrations. This allows for rapid interconnects across server nodes, which is essential for training LLMs and scaling neural network computing.
Technical advice and purchasing guidelines for global buyers and systems integrators.
A: The FusionServer V7 series features the newest Intel® Xeon® Scalable processors (Sapphire Rapids/Emerald Rapids) and supports DDR5 memory alongside PCIe Gen 5.0 interface architectures. The V6 series relies on 3rd Gen Intel® Xeon Scalable processors (Ice Lake) with DDR4 and PCIe Gen 4.0. The V7 series delivers higher operational performance and bandwidth, making it ideal for dense AI inference and large data workloads, whereas the V6 series remains a highly cost-efficient solution for traditional cloud server configurations and medium-scale enterprise environments.
A: Yes. We customize server hardware setups, including GPU integration, NVMe cache allocations (using drives like the PM9A3 series), and high-capacity system memory arrays. Our R&D team can optimize BIOS settings, NUMA nodes, and PCIe path allocation to ensure the server provides the processing speeds and GPU communication pathways required for LLM training and real-time deep learning inference.
A: We work directly with primary manufacturers and authorized distributors. Critical parts, such as LSI Broadcom RAID controllers, enterprise HDDs, and processor modules, are tracked via serial numbers. Our QC department, consisting of 45+ specialized inspectors, validates each part to guarantee original components and reliable long-term hardware performance.
A: Standard configurations are assembled, tested, and shipped within 7 to 15 business days. Extensive OEM setups—which may include custom front panels, tailored chassis configurations, and specialized network adapters—require 20 to 35 business days, depending on materials availability. We keep clients updated with regular progress reports from our Shenzhen factory throughout production.
A: NexGPU has over 7 years of international trade experience. We offer flexible incoterms (FOB, CIF, DDP, EXW) and work with reliable freight forwarders. We supply comprehensive documentation, including HS Code classification, Certificate of Origin, CE/FCC documentation, and packing lists to ensure smooth customs processing worldwide.
Additional enterprise hardware solutions, rackmount nodes, and storage expansion accessories.
